产品展示
- 层数:12层
Number of layers: 12 layers
板厚:3.6mm
Thickness:3.6mm
最小孔径:0.6mm
Min. Hole:0.6mm
材料:RO4350
Base Material:RO4350
技术特点:高频、高可靠性、压接孔、背钻
Technical Feature:High frequency,high reliability,press fit, backdrill
- 层数:4层
Numberoflayers:4layers
板厚:35mm
Thickness: 3.5mm
最小孔径:0.6mm
Min.hole:0.6mm
材料:RT5880
Base material: RT5880
技术特点:混压、阶梯槽、埋孔
Technical Feature: Mix lamination,step slot, buried hole
- 层数:4层
Numberoflayers:4layers
板厚:18mm
Thickness:1.8mm
最小孔径:1.0mm
Min. hole: 1.0mm
材料:RO4534
Base material:RO4534
技术特点:FR-4与陶瓷基板混压
Technical Feature: Mix lamination of FR-4 and ceramic material
- 层数:4层
Numberof layers:4layers
板厚:16mm
Thickness:1.6mm
最小孔径:06mm
Min.hole:0.6mm
材料:TLC-32+FR-28
Base material:TLC-32+FR-28
技术特点:高频、高可靠性
Technical Feature:High frequency，highreliability
- 层数:4层
Number of layers:4layers
板厚:20mm
Thickness:2.0mm
最小孔径:0.6mm
Min.hole:0.6mm
材料:聚酰亚胺(P|)
Basematerial:Polyimide(Pi)
技术特点:材料耐高温、耐辐射
Technical Feature: Heat-resistant,radiation resistant
- 层数:4层
Number of layers: 4layers
板厚:16m
Thickness:1.6mm
最小孔径:0.4mm
Min.hole:0.4mm
材料:FR-4+RO4350
Base material:FR-4+RO4350
技术特点:FR-4与陶瓷基板混压
Technical Feature: Mix lamination of FR-4 and ceramic material
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