产品展示
- 层数:1层
Numberoflayers:1layer
板厚:1.5mm
Thickness:1.5mm
最小孔径:0.8m
Min. hole:0.8mm
材料:1mm铜基+0.5mmPTFE材料
Base material: 1mm Copper Based
Material+0.5mm PTFEMaterial
技术特点:散热、高频
Technical Feature: Heat dissipation, high frequency
- 层数:1层
Numberof layers:1layer
板厚:53mm
Thickness: 5.3mm
最小孔径:0.5mm
Min.hole:0.5mm
材料:铝基板+PTFE
Base material: Aluminum Based Material+PTFEMaterial
技术特点:锡膏压焊、高频、散热
Technical Feature: Solder paste pressure elding,high frequency, heat dissipation
- 层数:1层
Numberof layers:1layer
板厚:125mr
Thickness:1.25mm
最小孔径:20mm
Min. hole: 2.0mm
材料:1mm铜基+0.25mmPTFE材料
Base material: lmm Copper Based
Material+0.25mmPTFEMaterial
技术特点:散热、高频
Technical Feature : Heat dissipation, high frequency
- 层数:1层
Number of layers: 1 layer
板厚:53mm
Thickness:5.3mm
最小孔径:3.0mm
Min.hole:3.0mm
材料:铝基板+PTFE
Base material: Aluminum Based Material
+PTFEMaterial
技术特点:散热、高频、阶梯
TechnicalFeature:Heatdissipation,high frequency,step
- 层数:2层
Numberof layers:2layers
板厚:40mm
Thickness:4.0mm
最小孔径:0.8mm
Min. hole size:0.8mm
材料:铜基板+PTFE
Base material: Copper Base+PTFE
技术特点:锡箔压焊、高散热、高频
TechnicalFeature:Tinfoil pressure welding superior heat dissipation,high frequency
- 层数:1层
Numberof layers:1layer
板厚:1.0mm
Thickness:1.0mm
最小孔径:30mm
Min. hole: 3.0mr
材料:铝基板+复合陶瓷
Base material: Aluminum Based Material
+Composite Ceramic Material
技术特点:高散热
TechnicalFeature:Superior heat
dissipation
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