产品展示
- 层数:4层
Number of layers:4layers
板厚:10mm
Thickness:1.0mm
最小孔径:0.4mm
Min.hole:0.4mm
材料:RO4350+FR-4
Base material:RO4350+FR-4
技术特点:盲孔、混压
Technical Feature: Blind hole, mix lamination
- 层数:4层
Number of layers: 4 layers
板厚:06mm
Thickness:0.6mm
最小孔径:0.3mm
Min.hole:0.3mm
材料: TSM-DS3+FR-28
Base material: TSM-DS3+FR-28
技术特点:内层埋平面电阻、阶梯
Technical Feature: Planar embedded resistor in inner layer, step
- 层数:4层
Number of layers:4layers
板厚:1.0mm
Thickness:1.0mm
最小孔径:0.3mm
Min.hole:0.3mm
材料:F4B+FR-4
Base material:F4B+FR-4
技术特点:阶梯、可立体安装
Technical Feature: Step, vertical assembly
- 层数:2层
Number of layers: 2 layers
板厚:0508m
Thickness: 0.508mr
最小孔径:0.8mm
Min. hole size: 0.8mr
材料:RT6010
Base mateial:RT6010
技术特点:高精度
TechnicalFeature:High precision
- 层数:4层
Number of layers: 4 layers
板厚:1.6mm
Thickness:1.6mm
最小孔径:0.4mm
Min.hole:0.4mm
材料:PPE
Base material:PPE
技术特点:工艺简化、可替代PTF材料
Technical Feature: Simple process,Substitute of PTFE material
- 层数:4层
Numberof]layers:4layers
板厚:0.8mm
Thickness:0.8mm
最小孔径:30mm
Min.hole:3.0mm
材料:RT5880+FR-4
Base material:RT5880+FR-4
技术特点:FR-4与PTFE混压
Technical Feature:Mix lamination of FR-4 and PTFE
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