产品展示
- 层数:3层
Number of layers:3layers
板厚:2.2mm
Thickness:2.2mm
最小孔径:12m
Min. hole:1.2mm
材料:RT5880
Base material: RT5880
技术特点:混压、阶梯
Technical Feature:Mixlamination,step
- 层数:8层
Number of layers: 8 layers
板厚:36mm
Thickness:3.6mm
最小孔径:0.6mm
Min.hole:0.6mm
材料:Dicla880
Base material: Diclad880
技术特点:混压、多层阶梯、镀厚金
Technical Feature:Mix lamination，multi-step, thick gold plating
- 层数:2层
Numberof layers:2layers
板厚:1.0mm
Thickness:1.0mm
最小孔径:0.8mm
Min. hole:0.8mm
材料:TLY-5
Base material:TLY-5
技术特点:阶梯槽
Technical Feature: Step slot
- 层数:3层
Number of layers:3 layers
板厚:32mm
Thickness:3.2mm
最小孔径:3.0mm
Min.hole:3.0mm
材料:RO4350
Base material:RO4350
技术特点:混压、阶梯
TechnicalFeature:Mix lamination,step
- 层数:2层
Number of layers: 2 layers
板厚:5.0mm
Thickness:5.0mm
最小孔径:10mn
Min . hole: 1.0mm
材料:RO4003
Base~material:RO4003
技术特点:混压、超厚
Technical Feature: Mix lamination，super-thick
- 层数:6层
Number of layers:6layers
板厚:30mm
Thickness:30mm
材料:聚酰亚胺发泡材料
Base material: Polyimide Foaming Material
技术特点:聚酰亚胺发泡材料与PTFE混压、
超厚、超大版面
Technical Feature: Mix lamination of
polyimide foaming material and PTFE,
super-thick,large panel
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